2019 2nd IEEE International
Conference on Information Communication and Signal Processing (ICSP 2019)
Communication Systems worldwide have provided a rapidly growing and useful range of services and are continuing to evolve using a multitude of Signal Processing techniques. 2019 2nd IEEE International Conference on
Information Communication and Signal Processing (ICSP 2019) will be
held in Shandong University, Weihai, China on September 28-30, 2019, follows the very successful "ICSP 2018".
The applications of signal processing are vast and interdisciplinary-ranging from engineering to economics and astronomy to biology. The research in areas such as signal coding and de-noising have paved the path for these advancements. Recent decade has witnessed major revolution in communication and processing of digital media. As a consequence, solution to major problems in processing, transmission and reception have made signal processing an integral part of modern electronic and communication systems. Communication on the other hand plays major role in our day to day life. The communication technology helps in the advancement of modern systems to meet our need of efficient exchange of ideas. The current research includes the areas of cognitive radio and IOT.
As in the previous year, the conference is technically co-sponsored by the IEEE. Accepted and presented papers have been published in the conference proceedings by IEEE and submitted to IEEE Xplore.
为增进各国信息通讯与信号处理学者与专家之间的学术交流, 分享研究经验, 探寻合作机会, 推动相关领域科学研究的发展, 2019年第二届IEEE信息通讯与信号处理国际会议将于2019年9月28-30日在山东大学威海校区召开, 会议定位为信息通讯和信号处理应用技术及产业化发展交流探讨，面向智能技术企业和科研院所研发人员, 工程师, 市场开拓者和行业组织, 涉及内容为模式识别应用技术发展趋势, 应用模式, 商业模式, 创业经验等.
Submitted papers will be
peer-reviewed by technical program committees based on the paper's
topic, quality, etc. Accepted and presented papers will be
published into conference proceedings, which will be submitted and reviewed by
Compendex and Scopus Index. Welcome you to submit your full
paper or abstract by
Electronic Submission System.
ICSP 2018 conference proceedings have been online in IEEE Xplore.